High Thermal Pad

PRODUCT DESCRIPTION

High thermal conductivity silicon film is characterized by high thermal conductivity and good insulation performance. The raw materials of the product are high thermal conductivity spherical aluminum oxide powder from DENKA and Dow Corning polymer. It is a cost-eective thermal insulation filling material with natural micro viscosity and softness on the surface, which can fully fill the air gap, Complete seamless heat transfer between heat source and heat sink to improve thermal conductivity. It is an ideal interface material for high performance heat conduction.

PRODUCT FEATURES

Cost eective, high thermal conductivity,low thermal resistance.
High fit, soft and elastic.
High electrical insulation, protect sensitiveelectronic devices.
Natural stickiness, easy to assemble and disassemble.

TYPICAL APPLICATION

CPU / memory / high speed hard disk drive
Microprocessors, memory chips and graphicsprocessors
New energy vehicles and peripheral / charging machines

Network communication equipment
Heating module with high heat conductiondemand

Test items	Unit	FS400	FS500	FS600	Test Method
Colour	-	Gray	Gray	Gray	Visual
Thickness	mm	0.5-5.0	0.5-5.0	0.5-5.0	ASTM D374/374M
Hardness	Shore A0	30 ± 5	30 ± 5	30 ± 5	GB/T 531
Specific Gravity	g/cm³	3.24	3.32	3.43	ASTM D792
Tensile Strength	Mpa	0.14	0.20	0.22	ASTM D412
Elongation	%	32	60	16	ASTM D412
Tear Strength	KN/m	0.70	0.5	0.5	ASTM D624
Breakdown Voltage	KV/mm	≥8	≥7	≥7	ASTM D149
Volume Resistivity	Ω·cm	1X10¹³	2X10¹³	2X10¹³	ASTM D257
Continuous Use Temp	°C	-40~200	-40~200	-40~200	-
Flame Rating	-	V-0	V-0	V-0	UL 94
Weight Loss	%	≤0.2	≤0.2	≤0.2	@150°C 240H
Dielectric Constant	@1MHz	6.75	7.92	7.47	ASTM D150
Thermal Conductivity	W / M·K	4.0	5.0	6.0	ISO 22007-2
Thermal impedance	°C·in² / w	0.340	0.295	0.188	ASTM D5470

High Thermal Pad

PRODUCT DESCRIPTION

PRODUCT FEATURES

TYPICAL APPLICATION

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