Thermal Pad

AM thermal silicone sheet is a universal and economical thermal sealing gasket with high cost performance, soft, self-adhesive and easy assembly. It shows good thermal conductivity and electrical insulation performance under low-pressure compression force. It paves the gap between the heating device and the heat sink or the machine shell, extrudes air to achieve full contact, and forms a continuous heat conduction channel. Using the heat sink or the machine shell as the heat sink, the heat dissipation area can be eectively improved, so as to eectively improve the heat dissipation eect.

PRODUCT FEATURES

Compression percentageLow cost, high eciency, high cost performance
Thermal conductive silicone grease to replace volatile pollution
Natural stickiness, easy assembly, repeatabledisassembly
Wide thickness range, can fill any uneven size gap
High electrical insulation

TYPICAL APPLICATION

ThicknessComputer / communication equipment
Laptop / tablet / PC server
New energy power battery / vehicle equipment

Switching power supply / UPS / Video security equipment
Any heating element and radiator

TECHNICAL SPECIFICATION

Test items	Unit	FS120	FS200	FS300	Test Method
Colour	-	OFF WHITE	BLUE	BLUE	Visual
Thickness	mm	0.3-15	0.3-10	0.3-10	ASTM D374/374M
Hardness	Shore A0	30 ± 5	30 ± 5	30 ± 5	GB/T 531
Specific Gravity	g/cm³	2.07	2.74	3.0	ASTM D792
Tensile Strength	Mpa	.34	.26	0.19	ASTM D412
Elongation	%	100	80	40	ASTM D412
Tear Strength	KN/m	1.4	0.8	0.9	ASTM D624
Breakdown Voltage	KV/mm	≥10	≥10	≥10	ASTM D149
Volume Resistivity	Ω·cm	1X10¹³	1X10¹³	1X10¹³	ASTM D257
Continuous Use Temp	°C	-40~200	-40~200	-40~200	-
Flame Rating	-	V-0	V-0	V-0	UL 94
Weight Loss	%	≤0.3	≤0.3	≤0.3	@150°C 240H
Dielectric Constant	@1MHz	5.41	6.28	7.0	ASTM D150
Thermal Conductivity	W / M·K	1.2	2.0	3.0	ISO 22007-2
Thermal impedance	°C·in² / w	1.108	0.787	0.483	ASTM D5470

Thermal Pad

PRODUCT FEATURES

TYPICAL APPLICATION

TECHNICAL SPECIFICATION

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